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About the detection and production of transformer skeleton samples

Text:[Big][Middle][Small] Release time:2016/9/26 20:19:06  Views:

1. Sample inspection and recognition phase:

Engineering or business in the sample, the product must be rigorously tested and checked:

A product size, especially in the important parts of the customer requirements, wall thickness as the focus of control.

B strength test, the general skeleton can reach 3Kgf, for the structure is relatively thin or small products, the intensity is relatively small.

C withstand voltage test, through the high-pressure test (such as 3.5KV, 2mA, 60S pressure conditions), in the design phase to avoid the selection, the wall thickness is irrational caused by poor pressure.

D solder test, the test pin on the tin situation, as well as by the moment (1-3S) high temperature after the deformation of the body, the bubble situation.

E product flatness, testing and PCB board contact with the bottom of the bump or plane, whether there is warping deformation of the situation, the general industry to 0.1mm max as the standard control, the larger the skeleton, the degree of flatness can be relaxed. The current post-type skeleton of the pin-level control of the most stringent control, because the pin is a direct link with the PCB flat posts linked to the control point.

F customers need to make important CPK control, the need to increase CPK confirmation.

G Customers acknowledge the product, should retain the sample products and customers to sign the acknowledgment.

H information documents (product specifications, operating standards, the entire inspection instructions, packaging specifications, etc.) to be issued to the relevant departments, so that the subsequent mass production of product quality control.

I skeleton changes, in the picture to make changes in the logo, increase the version of the change in the details of the record; at the same time to make isolation before the product to deal with, to avoid before and after the mold change product mix.

2. skeleton production stage

① injection molding

The process is the high temperature of the melt bakelite raw materials, plastic material through the injection molding machine pressure, spray to the skeleton mold cavity, after a certain molding and cooling time, through the ejection system to make the skeleton from the mold. The process of control for the focus of the injection temperature, pressure, and plastic materials in the ratio of recycled materials. Injection temperature and pressure changes, will certainly affect the basic changes in product size, product strength and characteristics of the changes, as well as the thickness of the flash changes, burr thickness situation will directly affect the operation of the next process. The process can be controlled by the PQC into the SPC to monitor this series of changes in order to early detection of changes, as soon as possible to make the appropriate adjustments to further ensure the quality of the product. On the production of finished mold, the need for timely cleaning and maintenance, in order to extend the service life of the mold for enterprises to bring more benefits. Transformer skeleton

② burr treatment

This process is mainly for bakelite skeleton, for the smooth discharge of the process of forming the gas generated, we need to increase the exhaust groove in the mold, the melting of raw materials under the action of high pressure filled with exhaust, so we need to pass The specific process, the use of flash processing machine to deal with the burr. In the control of the burr, we need to measure the size of the product to determine whether the thickness of the skeleton due to the thickness of the skeleton; another general whether the bristles to determine whether the light can handle clean.

In the burr processing process, we should be noted in the structural characteristics of the product, such as the trunking slot size, product blade strength, to select the size of sand. Otherwise it will cause the sand particles caught in the trough to block the copper wire, or stuck in the pinhole to affect the next pin of the process. After the pin as far as possible not to be burr treatment, otherwise it will affect the vertical of the pin.

For plastic products, only through manual processing. SMD class of bakelite products, can be handled through the tunnel-type edge machine, and then manually handle the stick on the edge of the stick.


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